Pilot250

 

Technical Parameter

 

Technology TypeStereolithography (SLA)
Build Envelope Capacity250 x 250 x 250 mm
AccuracyL < 25.4 mm: ±0.025 mm
L ≥ 25.4 mm: ±0.1% x L
Layer Thickness0.05 – 0.25 mm
Recoater FrameGranite
LaserSolid-state frequency tripled Nd: YVO₄
Beam Size0.06 – 0.08 mm
Wavelength355 nm
Scanning Speed6 ~ 10 m/s
Controlling SoftwareUnionTech™ RSCON
Data Preparation SoftwarePolydevs
Operation SystemWindows 10
Input Data File FormatSTL
Network Type and ProtocolEthernet, IEEE 802.3 using TCP/IP and NFS
Electrical Requirements200-240 VAC, 50/60 Hz, Single phase
Rated Power2.4 kVA
Systems ControlClosed-loop
Temperature Range72–79 °F (22–26 °C)
Maximum Change Rate1 °C/hour
Relative Humidity< 40% non-condensing
Machine Size (W x D x H)1105 × 1060 × 1977 mm
Machine Weight726 kg
Initial Resin Weight43 kg
Resin TankManually replacing
Processing and FinishingPost-Curing Unit (optional)
Warranty12 months